首頁 | The 37th VLSI Design/CAD Symposium

大會簡介

第37屆超大型積體電路設計暨計算機輔助設計技術研討會 (VLSI Design/CAD Symposium) 謹訂於 2026年8月4日至2026年8月7日假台南福爾摩沙遊艇酒店舉辦。本屆大會主題為「Smart Silicon Systems: Engineering a Better Society」，依研究主題分為10個分組35個子領域，公開徵求各界稿件。除了口頭/海報論文發表及短期課程外，大會將邀請多位產學界菁英，就當前智慧矽系統在邁向工程優化與提升社會福祉市場所面臨的新挑戰、新議題進行專題演講。同時安排一系列設計與量測前瞻技術論壇、學術與職涯規劃座談會及各項動態展示等活動，期盼促進學術與產業間的深度交流與合作。

智慧矽系統技術

探討前瞻 VLSI 設計與 CAD 技術創新應用，涵蓋類比射頻電路、數位系統設計、AI 晶片架構、先進製程 EDA 工具開發與測試等領域。

產學交流合作

促進學術界與產業界深度交流與技術合作，搭建研發成果技術轉移與產學聯盟的實質橋樑。

職涯發展媒合

橋接企業徵才與學生就業的雙向交流平台，為半導體產業人才供需創造最佳媒合機會，讓碩博士生與產業界優秀人才面對面交流。

大會徵稿

徵稿期間：
投稿系統開放日~ 2026 年 5 月 12 日止
論文錄取通知日：2026 年 6 月 17 日

備註：
論文經錄取後，須至少一位作者註冊並出席發表或海報展示說明。大會設有最佳論文(Best Paper)獎項，歡迎各界踴躍投稿，共同參與難得的年度盛會。
*獲選 Best Papers 將推薦至 IJEE Special Issue

論文格式：
限以英文書寫，請用 A4 Double-Column 9pt 格式，2~4 頁為限，檔案大小不得超過 10MB。論文撰寫請參照 IEEE 標準格式，範例請見下方連結。一律電子投稿，限用 PDF 檔案格式，格式不符恕不接受投稿。

論文格式範例下載：
參考格式 MS Word： 範本下載

Requirements

2-4 pages
IEEE 2-column format
PDF format only
Original work
Author attendance

論文投稿主題

Analog & RF

Subcomm. 1: Analog Circuits and Systems (ACS)

Analog Circuits and Sensor Interfaces
Medical Devices and Biomedical Systems
Imagers and Display Drivers

Subcomm. 2: Data Converters (DC)

Nyquist-Rate and Oversampling A/D and D/A Converters
Embedded and Application-Specific A/D and D/A Converters
Sub-Circuits for Data Converters, Including Sample-and-Hold Circuits, Calibration Circuits, etc.

Subcomm. 3: Power Management and Energy Systems (PMES)

Power Electronic Circuits and Systems
Power Converters
Energy Harvesting Circuits
Wireless Power Transfer Circuits and Systems

Subcomm. 4: RF, Wireless, and Wireline (RWW)

Wireline (Optical/Electrical) Transceiver Systems and Circuits
Wireless Transceiver Systems and Circuits

Digital & System

Subcomm. 5: Digital Circuits and Systems (DCS)

Low-Power Logic, Arithmetic Circuits, and Hardware Security
Multi-Core Systems, Network-on-Chip, and Embedded SoC Systems
Baseband Signal Processing ICs, Communication & AIoT Systems
B5G and Satellite Communications

Subcomm. 6: AI and Memory Systems (AIM)

Artificial Intelligence Circuits and Systems, Neuromorphic Hardware
Memory Hardware Circuits and GPU/NPU Systems

Subcomm. 7: Signal Processing and Healthcare (SPH)

Digital Signal Processing ICs, Image/Visual & Multimedia Systems
Biomedical, Bioinformatics, Biometrics, and Healthcare Systems

EDA & Testing

Subcomm. 8: Testing and Verification (TV)

Fault Model/Simulation, DFT and ATPG
Mixed-Signal/RF/Memory/MEMS Tests
Chiplet, 2.5D and 3D IC Tests
Design and Test for Reliability, Safety and Security
AI-based Tests and Testing for AI Systems
Design Validation, Verification and Debug
Test for Emerging Technologies

Subcomm. 9: Electronic Design Automation for Advanced Technologies and Heterogeneous Integration (EDA-ATHI)

AI-Driven Design Automation Across System, Logic, and Physical Levels
Physical-Level Design Automation Including Placement, Routing, Optimization, and Physical Verification
Timing/Power/Thermal Modeling/Analysis/Optimization and DFM

Emerging Technologies

Subcomm. 10: Emerging Technologies and Applications (ETA)

Automotive Electronics and Systems
Edge and Cloud Computing
Lab-on-a-Chip
Quantum Computing Circuits and Systems
Others

日期	公告
2026/02/01	網站上線

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